PT Tower Bersama Infrastructure Tbk Announces Rupiah Bond Offering

JAKARTA, 27 June 2016 - PT Tower Bersama Infrastructure, Tbk. ("TBIG") announced that it has priced its Continuous Rupiah Bond II Phase I Year 2016 (“TBIG Bond II Phase I”).

The TBIG Bond II Phase I has a total issuance size of Rp230 billion at a fixed interest rate of 9.25% for a tenor of 5 years and will have quarterly coupon payments. The TBIG Bond II Phase I will constitute senior unsecured obligations of TBIG. 

Use of proceeds from this offering, after deducting the costs of issuance, will be used to partially repay existing financial liabilities of the Company’s subsidiaries, in particular, Facility B of the existing Credit Facilities.

TBIG Bond II Phase I obtained a local AA- rating from Fitch Indonesia. The Company received effective statement from OJK for TBIG Bond II Phase I and this offering will be listed on the Indonesian Stock Exchange. 

“This 5-year Rupiah bond offering diversifies our funding sources and extends our debt payment schedule further. We hope to continue to tap the Rupiah bond market for part of our future funding requirements,” said Hardi Wijaya Liong, CEO of TBIG.

About PT Tower Bersama Infrastructure Tbk:
PT Tower Bersama Infrastructure Tbk (“TBIG”), is a provider of telecommunications infrastructure for the placement of BTS by telecommunications operators in Indonesia. TBIG is publicly listed on the Indonesian Stock Exchange and is majority owned by Saratoga Group and Provident Capital. 

For more information contact:

Corporate Secretary:
Helmy Yusman Santoso – Tower Bersama Group
Phone: (62-21) 2924 8900
Email: corporate.secretary@tower-bersama.com 

Investor Relations:
Veronica Jordan
Phone: (62-21) 2924 8900
Email: veronica.jordan@tower-bersama.com