PT Tower Bersama Infrastructure Tbk (TBIG) Announces Rupiah Bond Issuance

PT Tower Bersama Infrastructure Tbk ("TBIG") announces that it has closed its Continuous Rupiah Bond V Phase V Year 2022 (“TBIG Bond V Phase V”) under its IDR15 trillion Bond V Program.

The TBIG Bond V Phase V has a total issuance size of IDR1.0 trillion at a fixed interest rate of 5.25% for a tenor of 370 days. The TBIG Bond V Phase V will constitute senior unsecured obligations of TBIG and have quarterly coupon payments.  The use of net proceeds will be to partially repay the Company’s existing financial liabilities, in particular  the USD375 million Revolving Credit Facility.

The TBIG Bond V Phase V will be listed on the Indonesian Stock Exchange on 24 October 2022.

Total gross debt as of 30 June 2022, valuing USD loans at their hedged exchange rate, was IDR25,220 billion and gross senior debt was IDR2,503 billion. Cash balances as of 30 June 2022 were IDR718 billion, resulting in net debt of IDR24,502 billion and net senior debt of IDR1,784 billion. Using the second quarter 2022 annualized EBITDA, the net debt to EBITDA ratio is 4.2x.

“Post this issuance, we can still issue ~IDR7 trillion in Rupiah Bonds under our existing TBIG Bond V Program.  We have ~90% of our debt in fixed-interest local and foreign currency bonds and we expect to regularly access the Rupiah bond market,” commented Helmy Yusman Santoso, CFO of TBIG.

About PT Tower Bersama Infrastructure Tbk:
PT Tower Bersama Infrastructure Tbk (“TBIG”), is a provider of telecommunications infrastructure for the placement of BTS by telecommunications operators in Indonesia. TBIG is publicly listed on the Indonesian Stock Exchange and is majority owned by Bersama Digital Infrastructure Asia.

For more information contact:

Corporate Secretary:
Helmy Yusman Santoso – Tower Bersama Group
Telp. (62-21) 2924 8900
Email: corporate.secretary@tower-bersama.com

Investor Relations:
Veronica Jordan
Telp. (62-21) 2924 8900
Email: veronica.jordan@tower-bersama.com